LOGIC / MEMORY

LOGIC / MEMORY

LOGIC / MEMORY

Test Socket

Test Socket

We can make propose sockets that correspond to almost all packages.
With custom products by cutting, the quantity of products can be manufactured from 1 piece.
Depending on the production quantity, it is also possible to manufacture molded sockets from making molds.
Materials are selected according to the device and test environment.
We can correspond to a wide range from small packages of 1.0 mm or less to ICs over 1,000 pins.
We are good at various mechanical designs, so contact us if you feel confused.

Burn-in Socket

Burn-in Socket

Our products have been delivered to domestic major semiconductor manufacturers.
We reduced the size of the socket and minimized the board mounting area by making the socket mechanism compact.
You can choose the most suitable contact according to the socket's usage conditions. (Contacts applying for room temperature can be selected)
There is a PKG detachment mechanism against the sticking problem that occurs in the burn-in test.
We can correspond to various package shapes because it is possible to cut the socket adapte.

Socket basic specification

Basic specification
Contact pressure 11~14g/pin(高温用)
17~22g/pin(常温用)
Contact resistance (initial) 200~300mΩ
Adaptation temperature -40 ~ +150℃
Maximum permissible current value 0.6amp

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