Burn-In Test Socket (E/F/G/H Series)
Suitable for multi pins, despite the compact size.
Contact is suitable for high temperature and normal, which allows the best option for the environment to use socket.
PKG separating function against sticking is equipped.
Used by a large semi-conductor manufacturer.
| Socket Basic Specs | ||
| Basic Specs | ||
| Contact Pressure | 11-14g / pin (high temp) 17-22g / pin (normal temp) |
|
| Contact Resistance (default) | 200-300m |
|
| Durable Temperature | -40 - +150C | |
| Electric Current Capacity | 0.6amp | |
| Socket Size 28.0mm X 22.0mm | ||
| DIP | SMT | |
| Series | E | F |
| Hight | 17.0mm (Socket Free) 14.0mm (Cover Full Stroke) |
|
| Pitch [Matrix]] |
0.4mm [29 X 29] | |
| 0.5mm [24 X 24] | ||
| 0.65mm [19 X 20] | ||
| 0.8mm [15 X 15] | ||
| 1.0mm [12 X 12] | ||
| Max PKG Size | 14.0mm x 14.0mm | |
| Min PKG Size | 4.0mm x 4.0mm | |
*MAX/MIN PKG Size may slightly varies on matrix. |
||
| Socket Size 26.0mm X 22.0mm | |
| DIP | |
| Series | G |
| Hight | 17.5mm (Socket Free) |
| Pitch [Matrix] |
0.4mm [29 X 29] |
| 0.5mm [24 X 24] | |
| 0.65mm [19 X 20] | |
| 0.8mm [15 X 15] | |
| 1.0mm [12 X 12] | |
| Max PKG Size | 14.0mm x 14.0mm |
| Min PKG Size | 4.0mm x 4.0mm |
*MAX/MIN PKG Size may slightly varies on matrix. |
|
| Socket Size 26.0mm X 25.0mm | |
| DIP | |
| Series | H |
| Hight | 17.0mm (Socket Free) |
| Pitch [Matrix] |
0.5mm [24 X 31] |
| 1.0mm [12 X 16] | |
| Max PKG Size | 14.0mm x 18.0mm |
| Min PKG Size | 4.0mm x 4.0mm |
*MAX/MIN PKG Size may slightly varies on matrix. |
|
On the IC guide of the socket, contact line up adapter and IC guide are separated and only IC guide part is cut and processed on the package shape, in order to fit to various devices.
This method makes it possible to cut initial cost and supply low volume in a short time, as there is no need to shape IC guide at every package.
