Device Assembling Service
Test manufacturing before mass production, electric quality inspection, exterior inspection, inferiority analysis, reliability valuation testing are available.
Great experience in various package styles makes it possible to meet your particular needs.
Complete line of package assembling / testing / packing / delivering process supports any requests from a customer, from test assembling to large manufacturing.
SDK conducts an inspection based on customer's standard.
Analog testing and wafer testing are also available.
Exterior inspection, analysis service and sustainability evaluation are also available.
(QNF Package)
(CSP Package)
(CLCC Package)
(Image Sensor Package)
