SHONAN DENSHI KOGYO SDK Co., Ltd.

japanese page

tel : 0467-40-5567

 

THERMAL SOLUTION

Thermal Solution features socket structures to efficiently control heat dissipated from and applied to devices.

 

Passive Control
The heat sink dissipating heat and the airflow control provide efficient heat dissipation.

 

Active Control
Active control using heater, Peltier device, chiller (liquid cooling) and airflow provide accurate control of device temperature which varies per device.

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Aluminum alloy is used for socket housing.
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inquiry about ic socket, test soket, etc