SHONAN DENSHI KOGYO SDK Co., Ltd.

japanese page

tel : 0467-40-5567

Testing Service

  • SDK provide device testing service for wafer level inspection and outgoing inspection in package form.
  • In addition, SDK can assist customers in test specification design, tester evaluation, test program development, test process improvement, and failure analysis.
  • Experienced in : ESD Wafer Test, Package Test (LED, CMOS Image Sensor, MEMS:Proximity Sensor, Illumination Sensor, Gyroscope Sensor, CSP/QFN/DFN Package, and Others)

Site

CR Space

Process

Class

F1 Korea

CR:641.3㎡

EDS Test

< 1,000

CR:826.4㎡

LED Test

< 1,000

F2 Korea

CR:396㎡

EDS Test

< 100 & 1,000

CR:700㎡

PKG Test

< 10,000

F3 China

CR:2644.6㎡

EDS Test

< 1,000

CR:991.7㎡

PKG Test

< 10,000

 

Equipments at OKins Electronics

No.

Part

Equipment

Model

Q'ty

1

EDS

Tester

Teradyne [ETS-200]

5

1

EDS

Tester

Teradyne [ETS-200]

5

2

EDS

Tester

Teradyne [ETS-300]

1

3

EDS

Tester

Spea [C430MX]

2

4

EDS

Tester

Credence [ASL-1000]

2

5

EDS

Tester

Testian [SPiDer Nano]

1

6

EDS

Tester

Teradyne [A360]

10

7

EDS

Tester

Advantest [T3324]

1

8

EDS

Prober

EG4090u

1

9

EDS

Prober

EG4080

22

10

EDS

Handler

Synax [SX1101]

1

11

EDS

Handler

Merie [MR-5400]

2

12

EDS

RTA

RTA320EG

1

 

Line #1
Line #1

 

Line #2
Line #2

 

MEMS Test RTA Systems (Gyroscope)

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DEVICE PACKAGING SERVICE (FOR PROTOTYPING AND PRODUCTION)

  • SDK provide device packaging service for IC development and failure analysis, setting min. order quantity at 1 (one) piece.
  • The service is available for prototyping and production of MEMS devices and image sensor devices as well.

 

DEVISE POST-PROCESSING SERVICE

 

DEVISE POST-PROCESSING SERVICE

 


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