IC SOCKET, TEST SOCKET - SDK

BURN-IN SOCKET

Used by some large semiconductor manufactures in Japan.

Downsizing of the socket mechanism realized the smaller socket with minimum surface size.

Suitable for various contacts to best match the condition of socket usage.

(High pressure contact for normal temperature is acceptable.)

PKG separating function against sticking in burn-in is equipped.

Cutting process of the socket adaptor makes it suitable to various shapes of the packages.

BURN-IN SOCKET

Socket Basic Specs
Basic Specs
Contact Pressure	11-14g / pin (high temp) 17-22g / pin (normal temp)
Contact Resistance (default)	200-300m
Durable Temperature	-40 - +150C
Electric Current Capacity	0.6amp